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In 1965, ECS invented and patented the 19"
rackmount case concept revolutionizing electronic systems deployment
and operation. The original FRP composite rackmount cases began ECS'
march toward dominance of the military rackmount case market. |
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In 1985, ECS introduced its "Thermo
Stamped Composite" transit case material molded on hydraulic presses
up to 1,200 tons in capacity. TSC provides an unsurpassed combination
of low weight and high strength/impact resistance. TSC transit cases
and rackmount cases perform at extreme temperatures, making ECS cases
the preferred solution for worldwide military applications. |
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In 2000, ECS raised the bar again with the
development of shock isolated "Slide-Out-Rack" rackmount cases,
offering major labor savings during equipment installation, cable
routing and maintenance. ECS also developed "Stacking-Rack" electronic
rackmount cases with removable, sealed TSC panels on all six faces of
the rackmount frames. These extremely compact rackmount cases stack
and lock together when the TSC panels are removed and are fully
transportable and waterproof with TSC panels installed. |
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In 2004, ECS developed its LoadmasterTM
modular cases, LoadmasterTM TSC rackmount cases and
LoadmasterTM rotationally molded transit cases, all of
which are dimensionally integrated and employ identical molded-in
stacking features. Cases of different sizes interlock when stacked
together, making transportation and tactical operation of military
electronic systems safe and space efficient. |
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New in 2007, "Flip-Rail" TSC rackmount
cases allow full rack width electronic equipment to be slide-mounted
in TSC rackmount cases, with rotating vertical EIA rackmount rails
which allow equipment slides to be recessed. Also new in 2007,
"Slide-Out-Platform" shock mounted cases allow low-cost protection for
individual electronic devices that don't require a full rackmount
frame for attachment into the case. |